caution although this device is designed to be as robust as possible, esd (electrostatic discharge) can damage this device. this device must be protected at all times from esd. static charges may easily produce potentials of several kilovolts on the human body or equipment, which can discharge without detection. industry - standard esd precautions must be employed at all times. 0. 0 5 to 6 .0 ghz spdt switch gaas integrated circuit ? pg2 4 15 t 6x document no. pg10 7 9 7 ej0 1 v0ds ( 1st edition) date published march 20 10 ns description the ? pg 24 15 t 6x is a gaas mmic spdt ( s ingle p ole d ouble t hrow) switch for 0. 0 5 to 6.0 ghz applications, including dual - band wireless lan . this device operate s with dual control switching voltage s of 2. 7 to 3 .3 v. this device can operate at freq uenc ies from 0. 0 5 to 6 .0 ghz, with low insertion loss and high isolation. this device is housed in a 6 - pin plastic tson ( t hin s mall o ut - line n on - leaded ) (t6x) package and is suit able for high - density surface mounting. features ? switch control voltage : v cont (h) = 3.0 v typ. : v cont (l) = 0 v typ. ? low insertion loss : l ins = 0. 4 5 db typ. @ f = 2.5 ghz : l ins = 0. 5 5 db typ. @ f = 6.0 ghz ? high isolation : isl = 2 8 db typ. @ f = 2.5 ghz : isl = 26 db typ. @ f = 6.0 ghz ? h andling power : p in ( 0. 1 d b) = + 31 .0 dbm typ. @ f = 2 . 0 to 6 .0 ghz ? high - density surface mounting : 6 - pin plastic tson (t6x) package (1.5 ? 1.5 ? 0.37 mm) applications ? dual - band wireless lan etc. ordering information part number order number package marking supplying form ? pg 24 15t 6x - e 2 ? pg 24 15 t 6x - e 2 - a 6 - pin plastic tson (t6x) (pb - free) g 6 e ? embossed tape 8 mm wide ? pin 1, 6 face the perforation side of the tape ? qty 3 kpcs/reel remark to order evaluation samples, please contact your nearby sales office. part number for sample order: ? pg 24 15 t 6x - a
data sheet pg10 7 9 7 ej0 1 v0ds 2 ? pg2 4 15 t 6x pin connections and internal block diagram pin no. pin name 1 rf1 2 gnd 3 rf 2 4 v cont 2 5 rfc 6 v cont 1 remark exposed pad : gnd sw truth table v cont 1 v cont 2 rfc - rf1 rfc - rf2 high low on off low high off o n absolute maximum ratings (t a = +25 ? parameter symbol ratings unit switch control voltage v cont +6.0 note v input power p in +36 dbm operating ambient temperature t a ? 45 to +85 ? c storage temperature t stg ? 55 to +150 ? c note ? v cont 1 ? v cont 2 ? ? 6.0 v recommended operating range (t a = +25 ? parameter symbol min. typ. max. unit operating frequency f 0.05 ? 6.0 ghz switch control voltage (h) v cont (h) 2.7 3.0 3.3 v switch control volt age (l) v cont (l) ? 0.2 0 0.2 v control voltage difference ? v cont (h) , ? v cont (l) note ? 0.1 0 0.1 v note ? v cont (h) = v cont 1 (h) ? v cont 2 (h) ? v cont (l) = v cont 1 (l) ? v cont 2 (l)
data sheet pg10 7 9 7 ej0 1 v0ds 3 ? pg2 4 15 t 6x electrical characteristics (t a = +25 ? cont (h) = 3.0 v, v cont (l) = 0 v, z o = 50 ? parameter symbol test conditions min. typ. max. unit insertion loss 1 l ins 1 f = 0.05 to 0.5 ghz note 1 ? 0.35 ? db insertion loss 2 l ins 2 f = 0.5 to 2.0 ghz note 2 ? 0.40 0.65 db insertion loss 3 l ins 3 f = 2.0 to 2.5 ghz ? 0.45 0.70 db insertion loss 4 l ins 4 f = 2.5 to 3.8 ghz ? 0.55 0.80 db insertion loss 5 l ins 5 f = 3.8 to 6.0 ghz ? 0.55 0.80 db isolation 1 isl1 f = 0.05 to 0.5 ghz note 1 ? 30 ? db isolation 2 isl2 f = 0.5 to 2.0 ghz note 2 25 28 ? db isolation 3 isl3 f = 2.0 to 2.5 ghz 25 28 ? db isolation 4 isl4 f = 2.5 to 3.8 ghz 25 28 ? db isolation 5 isl5 f = 3.8 to 6.0 ghz 22 26 ? db return loss 1 rl 1 f = 0.05 to 0.5 ghz note 1 ? 20 ? db return loss 2 rl 2 f = 0.5 to 2.0 ghz note 2 15 20 ? db return loss 3 rl 3 f = 2.0 to 2.5 ghz 15 20 ? db return loss 4 rl4 f = 2.5 to 6.0 ghz 10 15 ? db 0.1 db loss compression p in (0.1 db) f = 0.5 to 2 .0 ghz note 2 ? +3 2 .0 ? dbm input power note 3 f = 2.0 to 6.0 ghz ? +3 1 .0 ? dbm 1 db loss compression input power note 4 p in (1 db) f = 0.5 to 2.0 ghz note 2 ? +36.0 ? dbm f = 2.0 to 6.0 ghz ? +3 5 .0 ? dbm 2nd harmonics 2f 0 f = 2.5 ghz, p in = + 2 0 dbm ? 80 ? dbc 3rd harmonics 3f 0 f = 2.5 ghz, p in = + 2 0 dbm ? 8 0 ? dbc input 3rd o rder intercept point iip 3 f = 2.5 ghz , p in = +20 dbm ? +60 ? dbm switch control current i cont no rf input ? 0.1 10 ? a switch control speed t sw 50% ctl to 90/10% rf ? 5 0 250 ns notes 1. dc blocking capacitors = 1 000 pf at f = 0.05 to 0.5 ghz 2. dc blo cking capacitors = 56 pf at f = 0.5 to 2.0 ghz 3 . p in (0.1 db) is the measured input power level when the insertion loss increases 0.1 db more than that of the linear range. 4 . p in (1 db) is the measured input power level when the insertion loss increase s 1 db more than that of the linear range. caution it is necessary to use dc blocking capacitors with this device. the value of dc blocking capacitors should be chosen to accommodate the frequency of operation, bandwidth, switching speed and the conditio n with actual board of your system.
data sheet pg10 7 9 7 ej0 1 v0ds 4 ? pg2 4 15 t 6x evaluation circuit note c1 : 0.05 to 0.5 ghz 1 000 pf : 0.5 to 2.0 ghz 56 pf : 2.0 to 6.0 ghz 8 pf the application circuits and their parameters are for reference only and are not intended for use in actual design - ins. application information ? c 1 are dc blocking capacitors external to the device. the value may be tailor ed to provide specific electrical responses. ? the rf ground connections should be kept as short as possible and connected to directly to a good rf ground for best performance. ? l esd provides a means to increase the esd protection on a specific rf por t, typically the port attached to the antenna.
data sheet pg10 7 9 7 ej0 1 v0ds 5 ? pg2 4 15 t 6x typical characteristics (t a = +25 ? cont (h) = 3.0 v, v cont (l) = 0 v, z o = 5 0 ? remark the graphs indicate nominal characteristics.
data sheet pg10 7 9 7 ej0 1 v0ds 6 ? pg2 4 15 t 6x remark the graphs indicate nominal characteristics.
data sheet pg10 7 9 7 ej0 1 v0ds 7 ? pg2 4 15 t 6x mounting pad and solder mask layout dimensions 6 - pin plastic tson (unit: mm) remark the mounting pad and solder mask layouts in this document are for reference only. when designing pcb, please consider workability of mounting, solder joint reliability, prevention of solder bridge and so on, in order to optimize the design.
data sheet pg10 7 9 7 ej0 1 v0ds 8 ? pg2 4 15 t 6x package dimensions 6 - pin plastic tson (t6x) (unit: mm)
data sheet pg10 7 9 7 ej0 1 v0ds 9 ? pg2 4 15 t 6x recommended soldering conditions this product should be soldered and mounted under the following recommended conditions. for soldering methods and conditions other than those recommende d below, contact your nearby sales office. soldering method soldering conditions condition symbol infrared reflow peak temperature (package surface temperature) : 260 ? c or below time at peak temperature : 10 seconds or less time at temperature of 220 ? c o r higher : 60 seconds or less preheating time at 120 to 180 ? c : 120 ? 30 seconds maximum number of reflow processes : 3 times maximum chlorine content of rosin flux (% mass) : 0.2%(wt.) or below ir260 partial heating peak temperature (terminal temperature) : 350 ? c or below soldering time (per side of device) : 3 seconds or less maximum chlorine content of rosin flux (% mass) : 0.2%(wt.) or below hs350 caution do not use different soldering methods together (except for partial heating).
10 data sheet pg10 7 9 7 ej0 1 v0ds ? pg2 4 15 t 6x cautio n gaas products this product uses gallium arsenide (gaas). gaas vapor and powder are hazardous to human health if inhaled or ingested, so please observe the following points. ? follow related laws and ordinances when disposing of the product. if there are no applicable laws and/or ordinances, dispose of the product as recommended below. 1. commission a disposal company able to (with a license to) collect, transport and dispose of materials that contain arsenic and other such industrial waste materials. 2. e xclude the product from general industrial waste and household garbage, and ensure that the product is controlled (as industrial waste subject to special control) up until final disposal. ? do not burn, destroy, cut, crush, or chemically dissolve the p roduct. ? do not lick the product or in any way allow it to enter the mouth.
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